JSC-66491
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Standard for JSC Lead-Free Control Plans
(LFCP)
Engineering Directorate
Avionic Systems Division
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Compliance is Mandatory
July 2013
Baseline
National Aeronautics and Space Administration
Lyndon B. Johnson Space Center
Houston, Texas 77058-3696
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TABLE OF CONTENTS
1 GENERAL
REQUIREMENTS ............................................................................................................. 5
1.1
SCOPE ................................................................................................................................................. 5
1.1.1 AUTHORITY ................................................................................................................................... 5
1.2 PURPOSE ............................................................................................................................................ 5
1.3 APPLICABILITY ................................................................................................................................... 5
1.4 ORDER OF PRECEDENCE ................................................................................................................ 5
1.5 APPROVAL OF DEPARTURES FROM THIS DOCUMENT ............................................................. 5
1.6 ROLES AND RESPONSIBILITIES ...................................................................................................... 6
2 APPLICABLE DOCUMENTS ............................................................................................................. 8
2.1
JSC DOCUMENTS .............................................................................................................................. 8
2.2 NASA STANDARDS AND DIRECTIVES ............................................................................................ 8
2.3 MILITARY STANDARDS ..................................................................................................................... 8
2.4 INDUSTRIAL STANDARDS ................................................................................................................ 8
2.5 REFERENCE DOCUMENTS .............................................................................................................. 9
3 LEAD-FREE CONTROL PLAN (LFCP) ........................................................................................... 10
3.1
PROJECT LEAD FREE CONTROL PLAN (LFCP) REQUIREMENTS ........................................... 10
3.1.1 LEAD-FREE CONTROL LEVEL DESIGNATION........................................................................ 11
3.1.2 LEAD-FREE TIN IDENTIFICATION AND REPORTING ............................................................ 11
3.1.3 TIN WHISKER RISK DOCUMENTATION ................................................................................... 11
3.1.4 TIN WHISKER MITIGATION ........................................................................................................ 11
3.1.4.1 DESIGN ................................................................................................................................. 11
3.1.4.2 HOT SOLDER DIP (HSD) .................................................................................................... 11
3.1.4.2.1. PRETINNING (PARTIAL HSD MITIGATION) ..................................................................... 12
3.1.4.3 CONFORMAL COATING ..................................................................................................... 12
3.1.4.4 EMBEDMENT / ENCAPSULATION ..................................................................................... 13
3.1.5 SURVEILLANCE (INSPECTION & FUNCTIONAL TEST) .................................................. 15
3.1.6 TIN PEST (TIN DISEASE) MITIGATION ............................................................................. 15
4 ACRONYMS AND ABBREVIATIONS AND GLOSSARY OF TERMS .......................................... 16
4.1
ACRONYMS AND ABBREVIATIONS ............................................................................................... 16
4.2 GLOSSARY OF TERMS.................................................................................................................... 16
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1. GENERAL REQUIREMENTS
1.1 SCOPE
This document prescribes requirements for the control and mitigation of performance and reliability risks
associated with the use of Lead-free Tin (Sn) and Lead-free Tin (Sn) technology in flight hardware, mission
essential support equipment, and elements thereof.
1.1.1 AUTHORITY
The authority for this document derives from requirement 5.f.5 of NASA Policy Directive 8730.2C (NPD-
8730.2c) “NASA Parts Policy”.
1.2 PURPOSE
This standard imposes a Lead-Free Control Plan (LFCP) to reduce the harmful effects of tin whiskers or tin
pest in JSC-certified spaceflight hardware.
1.3 APPLICABILITY
This document is applicable to JSC projects and programs, including JSC onsite and offsite contractors,
developing and producing flight hardware, mission essential support equipment, and elements thereof.
1.3.1 Commercial Off-The-Shelf (COTS). The requirements of this document shall not apply to suppliers of
commercial off-the-shelf (COTS) items. Projects which use COTS hardware for applications described
above shall be responsible for identifying and managing risks associated with hardware that was built
without a control plan to reduce the harmful effects of tin whiskers. The International Space Station (ISS)
program document, SSP 50835, provides guidance on how a Program may address the impact of utilizing
COTS hardware that was built without a control plan.
1.3.2 Existing or Previously Approved Designs. The requirements of this document shall not constitute the
sole cause for the redesign of previously approved designs. When drawings for existing or previously
approved designs undergo revision, they should be reviewed and changes made that allow for compliance
with the requirements of this document.
1.4 ORDER OF PRECEDENCE
The following shall be applicable in the resolution of conflict between the requirements or the text of this
document; and, applicable documents, and approved / unapproved engineering documentation in the order
indicated:
a. Program Requirements
b. This Document
c. Engineering Documentation (i.e. : Approved Drawing)
1.5 APPROVAL OF DEPARTURES FROM THIS DOCUMENT
Any changes, revisions, or deviations to the requirements of this document shall require technical
evaluation and approval by the JSC Lead Free Control Board (LFCB) with the programs having waiver
authority.
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a. Use of alternate control plans, documents, or processes shall require review and approval of the JSC
Lead Free Control Board (LFCB)
b. Less stringent control plans, documents, or processes meeting Level "2B" are allowed in exceptional
cases with the review and recommendation of the EEE Parts Control Board (EEE-PCB) and approval of
the Lead Free Control Board (LFCB).
c. Requests for relief from requirements in this document shall be documented and adjudicated in
accordance with NASA-STD-8709.20, Management of Safety and Mission Assurance Technical
Authority (SMATA) Requirements as implemented by the programs.
1.6 ROLES AND RESPONSIBILITIES
a. Project Function. Project shall generate a Lead-Free Control Plan (LFCP) in compliance with the
requirements of this document. Reference Appendix A, Project LFCP Template, as the minimum
content required for a Lead-Free Control Plan (LFCP).
b. Lead-Free Control Board (LFCB). The Lead-Free Control Board (LFCB) outlined in Figure 1 and co-
chaired by
Avionic Systems Division (JSC-EV) Process Engineering (JSC-EV5) and Special Processes
(JSC-NT), shall be convened on an as needed basis as a decision-making forum for the technical
review and approval of requests for:
(1) changes, revisions, or deviations to the requirements of this document
(2) use of alternate control plans, documents, or processes
The LFCB is the controlling authority for establishing the configuration baseline for all Lead-Free Control
Plans (LFCPs). The co-chairs of the LFCB are permanent members of the EEE Parts Control Board
(EEE-PCB) and the LFCB is part of the EEE-PCB.
c. EEE Parts Control Board (EEE-PCB). Reference JSC 64182 for the Charter for the Avionic Systems
Division Government Furnished Equipment (GFE) Electrical, Electronic and Electromechanical (EEE)
Parts Control Board (PCB).
(1): Or designated alternate
Figure 1: Lead-Free Control Board (LFCB)
LEAD-FREE CONTROL BOARD (LFCB)
CO-CHAIR
EV Process Engineer (JSC-EV5)
CO-CHAIR
Special Processes (JSC-NT)
EEE Parts Lead
(1)
(JSC-EV5)
Materials & Processes Lead
(1)
(JSC-ES4)
GFE Quality Engineering Lead
(1)
(JSC-NT4)
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d. JSC Avionic Systems Division, Electronic Design and Manufacturing Branch (JSC-EV5). JSC Avionic
systems Division, Electronic Design and Manufacturing Branch (JSC-EV5) shall approve all project
LFCPs.
e. JSC Special Processes (JSC-NT). JSC S&MA Special Processes (JSC-NT) shall review all project
LFCPs.
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2. APPLICABLE DOCUMENTS
The following documents are applicable to the extent specified herein. The applicable revision shall be that
identified herein or the revision in effect on the date of the contract or work authorizing document.
2.1 JSC DOCUMENTS
JSC 64182 ................................ Charter for the Avionic Systems Division Government Furnished
Equipment (GFE) Electrical, Electronic and Electromechanical (EEE) Parts
Control Board (PCB)
2.2 NASA STANDARDS AND DIRECTIVES
NASA-STD-8709.20 ................. Management of Safety and Mission Assurance Technical Authority
(SMATA) Requirements
NASA-STD 8739.1A ................. Workmanship Standard for Polymeric Application on Electronic Assemblies
NASA-STD-8739.2 .................. Workmanship Standard for Surface Mount Technology (cancelled)
NASA-STD-8739.3 ................... Soldered Electrical Connections (cancelled)
NPD 8730.2C ........................... NASA Parts Policy
NPD 8730.5B ........................... NASA Quality Assurance Program Policy
NPR 7120.5 .............................. NASA Space Flight Program and Project Management Requirements
NPR 8705.4 .............................. Risk Classification for NASA Payloads
2.3 MILITARY STANDARDS
<None>
2.4 INDUSTRIAL STANDARDS
GEIA-STD-0005-1 ..................... Performance Standard for Aerospace and High Performance Electronic
Systems Containing Lead-free Solder
GEIA-STD-0005-2 ..................... Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High
Performance Electronic Systems, Control Level 2C
GEIA-STD-0006 ...................... Requirements for Using Solder Dip to Replace the Finish on Electronic
Piece Parts
IPC-1601 .................................. Printed Board Handling and Storage Guidelines
IPC J-STD-001E-2010 ............ Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001ES ................... Space Applications Electronic Hardware Addendum to IPC J-STD-001E
Requirements for Soldered Electrical and Electronic Assemblies
IPC/JEDEC J-STD-020D.1 ..... Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State
Surface Mount Devices
IPC/JEDEC J-STD-033C ........ Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices
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2.5 REFERENCE DOCUMENTS
The documents listed below provide technical guidance which may be helpful to readers of this document.
Unless otherwise specified, the requirements and recommendations in these documents are not binding
and are not to be construed as implied requirements to be imposed on the program.
GEIA-HB-0005-1 ....................... Program Management / Systems Engineering Guidelines for Managing the
Transition to Lead-Free Electronics
GEIA-HB-0005-2 ....................... Technical Guidelines for Aerospace and High Performance Electronic
Systems Containing Lead-free Solder and Finishes
GEIA-HB-0005-3 ..................... Rework/Repair Handbook to Address the Implications of Lead-Free
Electronics and Mixed Assemblies in Aerospace and High Performance
Electronic Systems
GEIA-STD-0003 ...................... Long Term Storage of Electronic Devices
IPC/JEDEC J-STD-609 ........... Marking and Labeling of Components, PCBs and PCBAs to Identify Lead
(Pb), Pb-Free and Other Attributes
IPC-QL-653A ........................... Certification of Facilities that Inspect / Test Printed Boards, Components,
and Materials
JSC-STD-8080.5 ..................... JSC Design and Procedural Standards
JSC 27301F ............................. Materials and Processes Selection, Control, and Implementation Plan for
JSC Flight Hardware
MIL-D-3464E ........................... Desiccants, Activated, Bagged, Packaging, Use and Static
Dehumidification (Type II)
MIL-HDBK-338B ...................... Electronic Reliability Design Handbook
MIL-STD-2073-1E ................... Standard Practice for Military Packaging (Method 50)
MS20003C ............................... Indicator, Humidity, Card, Three Spot, Impregnated Areas (Cobaltous
Chloride), 30-40-50% RH
Metallurgical Assessment of Spacecraft Parts, Materials and Processes, Barrie D. Dunn, Wiley-Praxis,
1997, ISBN 0-471-96428-X
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3. LEAD-FREE CONTROL PLAN (LFCP)
3.1 Lead-Free Tin (Sn)
For the purpose of this document, lead-free Tin (Sn) is defined as metallic Tin (Sn) containing less than 3
percent lead (<3% Pb) by weight as an alloying constituent. Lead-free Tin (Sn) technology is defined as
electrical / electronic components and associated mechanical hardware and materials composed of, or
coated / plated (internal / external surfaces) with metallic Tin (Sn) containing less than 3 percent lead (<3%
Pb) by weight as an alloying constituent.
Lead-free Tin (Sn) technology shall include:
• Lead-free Tin (Sn) coatings/platings, metallization, etc., on external surfaces of EEE components,
mechanical parts, etc.; or, on internal cavity surfaces of EEE components (i.e.: hybrid, relay crystal
cans, MEMS etc.).
• Lead-free Tin (Sn) solder alloys containing less than 3 percent lead (<3% Pb) by weight as an alloying
constituent. Exception: Sn96.3Ag3.7
• Wiring technology (i.e.: wire, cable, connectors, terminators, clamps, braid / over-braid shield, etc.)
composed of, or coated / plated with metallic Tin (Sn) containing less than 3 percent lead (<3% Pb) by
weight as an alloying constituent.
• Any EEE components, electrical / electronic assembly, printed wiring assembly (PWAs), cable
assembly, and/or wire harness assembly assembled with lead-free tin solder alloy except high
temperature solder alloy Sn96.3Ag3.7 (Sn96A).
Note: Sn96.3Ag3.7 shall only be used where specifically indicated by approved drawings.
3.2 Project Lead Free Control Plan (LFCP) Requirements
The use of lead-free Tin (Sn) technology shall be prohibited unless documented and controlled through a
JSC-approved Lead Free Control Plan (LFCP).
The use of lead-free Tin (Sn) technology in applications with exposure to temperatures at or below -30°C (-
22°F) shall be prohibited unless controlled through mitigation (see 3.1.6).
The LFCP shall be in conformance with Control Level 2C requirements of GEIA-STD-0005-2, or as
directed by the Program, and reviewed and approved by the LFCB prior to implementation.
At a minimum, the project LFCP shall:
a. Avoid the use of lead-free Tin (Sn) technology whenever possible.
b. Document every incidence of lead-free tin technology and prevent its use without prior review and
approval of the LFCB. The documentation shall include a list of each individual piece part with a Pb-free
tin-finished surface and a description of the finish composition, and a list of what applications will include
that piece part.
c. Incorporate a minimum of two (2) mitigation measures when the lead-free tin finish is not completely
replaced through a replating or hot solder dip (HSD) process.
d. Include any special design requirements, mitigation measures, test and qualification requirements,
quality inspection and screening, marking and identification, maintenance, and repair processes.
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3.2.1 LEAD-FREE CONTROL LEVEL DESIGNATION
The lead-free control level shall be set when all other project requirements are being determined. The
default lead-free control level shall be 2C.
3.2.2 LEAD-FREE TIN IDENTIFICATION AND REPORTING
For control levels 2C (or higher), the LFCP shall require X-ray fluorescence (XRF) or similar testing of all
parts with external surfaces that appear similar to tin in color and texture (i.e. matte nickel, silver, etc.).
3.2.3 TIN WHISKER RISK DOCUMENTATION
The LFCP shall require an assessment of risk consistent with GEIA-STD-0005-2.
3.2.4 TIN WHISKER MITIGATION
Lead-free Tin (Sn) technology, which by package design or engineering decision prevents / prohibits
protection by SnPb replating or Hot Solder Dip (HSD), shall be protected by at least two (2) process or
design mitigation techniques to reduce or eliminate the risks created by metallic whisker formation and/or tin
pest in the expected end-use application / environment.
Mitigation is a systematic engineering approach to the control of risk. When considering any mitigation
strategy, the engineering function must assess the applicability, strengths and weaknesses of the specific
technique being employed. Use of mitigation techniques shall require technical review and approval by the
LFCB prior to implementation.
3.2.4.1 DESIGN
An evaluation of the relative risk of actively mitigating metallic whisker growth must be part of the design
process when the availability of components is limited to lead-free tin finishes. This shall include an
analysis to determine if the risk of whisker development is partially mitigated by the design and topography
of the hardware, spacing between electrically uncommon conductive surfaces, or choice of finish.
a. Design and Topography. Components, sub-assemblies, assemblies, and mechanical hardware
identified as having a lead-free tin finish shall be physically positioned or mechanically isolated by
board strengtheners, brackets, or other non-conductive components / structures to ensure the growth of
conductive whiskers does not adversely affect hardware performance or reliability.
b. Spacing. Direct line-of-sight spacing between electrically uncommon conductive surfaces shall be
sufficient to ensure whisker growth rates (1mm/yr. nominal) over the life of the mission do not violate
minimum electrical spacing requirements.
c. Finish - Adjacent Surfaces. Surfaces adjacent to components, sub-assemblies, assemblies, and
mechanical hardware identified as having a lead-free tin finish shall be finished with a non-electrically
conductive coating.
3.2.4.2 HOT SOLDER DIP (HSD)
The Hot Solder-Dipping (HSD) process for tin whisker and tin pest mitigation differs from the solder
tinning process for solderability in that all exposed surfaces of the lead-free tin plated conductors - up to
the body-lead seal – are replated with tin-lead (SnPb) solder alloy. Because the HSD process exposes
components to significant thermal stress, the process shall be repeatable, controlled, not introduce
immediate or latent damage, or degrade the performance of the component.
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A device shall no longer be considered to be lead-free tin finished if all lead-free tin finishes are replaced
through a replating or hot solder-dipping (HSD) process with a SnPb alloy having a minimum of 3% lead
(Pb) by weight.
The HSD process shall wet and replace all exposed surfaces of the conductors with a tin-lead (SnPb) alloy
having a minimum of 3% lead (Pb) by weight. This will involve immersion plating up to the body lead seal,
and will require verification that the process is controlled and does not introduce immediate or latent
damage, or degrade the performance of the component.
1. HSD solder alloy shall be Sn60Pb40, Sn62Pb36Ag02 or Sn63Pb37. Other alloys may be used with
prior approval from the procuring NASA activity.
2. Flux chemistry shall be ROL0 (R) or ROL1 (RMA). ROL2 (RA) or other chemistries may be used
with demonstration of process control, cleanability, and prior approval from the procuring NASA
activity.
3. Components shall be preheated prior to solder immersion to minimize thermal shock.
Thermal ramp
rates shall not exceed the following, unless specified by engineering documentation:
a. Ramp-up: Not greater than +4°C / sec. (+7.2°F / sec.)
b. Ramp-down: Not greater than -6°C / sec. (-10.8°F / sec.)
4. Solder immersion of conductors, terminations, or leads shall not exceed 5 seconds duration.
Duration of molten solder contact with the body-lead seal shall be minimized but shall be sufficient to
ensure full and complete wetting of the entire conductor / termination / lead surface (generally less
than 3 seconds maximum).
5. All components shall be properly cleaned, visually inspected per J-STD-001ES [4.2.3] and [11.2.2],
and demoisturized per IPC-1601, J-STD-020D, J-STD-033C, or other demoisturization schedule
approved by EV5.
3.2.4.2.1. PRETINNING (PARTIAL HSD MITIGATION)
The pretinning process used to comply with solderability requirements (ref.: J-STD-001E [4.3], NASA-STD-
8739.2 [7.2], NASA-STD-8739.3 [7.2.5]) is recommended as an alternative to Hot Solder Dip (HSD) only in
cases where the hardware design prohibits implementation of Hot Solder Dip (HSD). It is considered a
partial mitigation because only the portions of the lead-free tin-finished surfaces designated to be part of the
completed solder termination are replaced with SnPb alloy.
The remaining exposed lead-free tin finish between the pretinned section of the component lead and the
body-lead seal has the potential for whisker development and shall be protected by an additional mitigation,
such as conformal coating, embedment / encapsulation, or surveillance (inspection, functional test, etc.).
3.2.4.3 CONFORMAL COATING
External surfaces, platings, metallization, etc., with a lead-free Tin (Sn) finish shall be fully coated with
conformal coating with a total cured finish thickness of not less than 100 μm [0.004 in] for silicone (SR)
and urethane (UR), and not less than 50 μm [0.002 in] for paraxylene coatings. Total cured finish
thicknesses specified SHALL take precedence over requirements imposed by NASA-STD-8739.1A
[Table 10-1], or other user-approved conformal coating / polymeric standard.
a. Spray or Brush Application
Spray-applied or hand-brush-applied conformal coating is viewed as a significant mitigation tool as it
increases environmental resistance, retards the development and propagation of whiskers, and serves
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as an insulative barrier to Foreign Object Debris (FOD). However, spray or hand-brush application may
only be capable of achieving partial coverage for complex PWA designs, as the spray and hand-brush
processes only coat the visibly exposed surfaces, with some minor capillary flow under component
bodies. This leaves the most whisker prone areas of the assembly exposed, such as the backside of
component leads and leads located completely underneath component bodies (i.e.: BGA, flip chip, etc.).
b. Dip Coating
Dip coating, if performed correctly, will ensure the polymer flows under and around all package types
and terminations, producing a coating that wets all surfaces. Using a low viscosity material and a slow
submersion rate at a 30 – 45 degree angle will reduce the incidence of voiding (bubbles). Although
there is always some bridging of fine pitch component leads if a dip coat process is used, a slow and
steady withdrawal rate is recommended to minimize the effect.
c. Chemical Vapor Deposition
Of all the conformal coating processes, Paraxylene Resin (XY) is considered the best coating for
mitigation against whisker growth because it coats all exposed surfaces of the PWA with a stress-free,
pin-hole free, uniform thickness of material, including the backside of component leads and leads
located completely underneath component bodies (i.e.: BGA, flip chip, etc.).
3.2.4.4 EMBEDMENT / ENCAPSULATION
Use of embedment and encapsulation as mitigation is recommended for integrated circuit, fine-pitch, and
area array device packages, where conformal coating would have limited effectivity at coating the backside
of tightly spaced component leads (i.e.: IC, QFP, SOIC, etc.) or the terminations underneath the component
body (i.e.: BGA, flip-chip, etc.). The application process is similar to underfill, in that the embedment /
encapsulant material must flow underneath and completely fill the space between the component body and
the printed wiring board (PWB), then fully wet and cover all termination surfaces. This requires that the
materials be selected to closely match the coefficient of thermal expansion of the component and printed
wiring assembly (PWA).
a. Embedment or encapsulant material shall fully wet and cover all surfaces of parts and areas specified
by the approved engineering documentation.
Notes:
1. The effectiveness of conformal coating as a whisker mitigation technique depends heavily on
the coating material selected, application method, process control, and workmanship.
2. The use of silicone (SR) or urethane (UR) conformal coating as whisker mitigation is based on
NASA and industry research indicating that a finish thickness of not less than 50 μm [0.002 in],
will increase environmental resistance, retard the development and propagation of whiskers,
and reduce the potential performance and reliability
issues of tin whiskers. This is
accomplished by using the conformal coating as a resilient barrier to trap and contain a
significant portion of whisker growths to within the coating layer, to reduce or prevent whiskers
from contacting and shorting adjacent conductors, to limit exposure to moisture, and to limit the
development of coronal discharge.
3. While current research has suggested that a paraxylene (XY) coating thickness of greater than
25 μm (0.001 in) will control whisker growth, a final coating thickness of 50 - 100 μm (0.002 –
0.004 in) is recommended to provide optimal protection. Minimum total cured thickness
specified for paraxylene (XY) may require application of multiple coatings.
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b. Cured material shall be compatible with the hardware and mission environment, and shall not adversely
affect hardware performance or reliability.
Embedment and encapsulation is often used selectively and in conjunction with conformal coating, as the
process is considered very labor intensive.
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3.2.5 SURVEILLANCE (INSPECTION & FUNCTIONAL TEST)
A surveillance program involving visual inspection of a control unit for whiskers, and functional testing of
flight units is recommended as a supplement to other mitigations, such as SnPb pretinning, conformal
coating, etc. The program must recognize and accept that there is a significant assumption of risk in using
this strategy because the control unit may not be fully representative of the flight units, and a false sense of
security can be generated if no whiskers are observed on the control unit and the flight units pass functional
/ acceptance tests.
Uncertainty issues that must be taken into consideration when using this mitigation strategy include:
a. Inspection for whiskers requires extensive and repetitive handling of the hardware; stereo-optical
vision with a magnification power of 20X minimum; polarized, variable-intensity light sources; and, an
ability to rotate the hardware 360 degrees around a fixed viewing axis point during inspection.
Standard inspection stations with fluorescent light-rings are incapable of performing this task and
shall not be used.
b. Functional and acceptance testing only verifies that hardware performance has not degraded to a
level detectable by the test. As such, the tests should not be used as “certification” that the tested
hardware is whisker-free – only that the hardware was functional at the time of test.
c. Limited Life Article. Flight and mission essential hardware incorporating lead-free tin surfaces,
platings, metallization, etc., but which by package design or engineering decision are not protected by
SnPb replating or HSD, with a storage or flight life of ten (10) years from its assembly date, shall be
identified and tracked as a Limited-Life Article, and subjected to visual inspection and functional test
prior to use.
3.2.6 TIN PEST (TIN DISEASE) MITIGATION
Lead-free Tin (Sn) and Lead-free Tin (Sn) technology shall not be used in applications with exposure to
temperatures at or below -30°C -22°F), unless combined with one of the following alloys by weight
percentage:
a. Not less than 5 percent lead (Pb)
b. Not less than 0.3 percent bismuth (Bi)
c. Not less than 0.5 percent antimony (Sb)
d. Not less than 3.5 percent silver (Ag)
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4 ACRONYMS AND ABBREVIATIONS AND GLOSSARY OF TERMS
4.1 ACRONYMS AND ABBREVIATIONS
Acronym
Definition
BGA Ball Grid Array
COTS
Commercial Off-The-Shelf
EEE
Electrical, Electronic, and Electromechanical
GFE Government Furnished Equipment
HSD
Hot Solder Dip
IC Integrated Circuit
LFCB
Lead Free Control Board
LFCP Lead Free Control Plan
PWA
Printed Wiring Assembly
PWB
Printed Wiring Board
QFP Quad Flat Package
SOIC
Small-Outlined Integrated Circuit
XRF
X-Ray Fluorescence
4.2 GLOSSARY OF TERMS
For purposes of this document, the following terms and definitions apply:
Term
Description
Conformal Coating
A thin and electrically non-conductive coating which conforms to the
contours of the PWA to provide protection against Foreign Object
Debris (FOD) and environmental contamination.
Control Level 2B
For Level 2B hardware, these control plans may cover families of piece
part types or applications. Separate assessments and control plans for
each individual item are not required. For example, one assessment
might allow use of all tin-plated capacitors in a variety of applications.
Control Level 2C
A GEIA-STD-0005-2 selection protocol requiring the identification, risk
assessment, and controlled use of electrical/electronic components,
assemblies and mechanical hardware with Pb-free final finishes /
platings, underplating, base metals, solder; either external or internal to
an assembly, component, printed wiring board, or other hardware
composed of lead-free tin.
Electrical / Electronic Assembly
Any configuration of discrete and/or integrated electrical, electronic,
and/or electro-mechanical components; sub-assemblies; Printed
Wiring Assemblies (PWA); discrete wiring, cabling, or harnesses; fiber
optic components, or combinations thereof, that are joined together to
perform a control or processing function (i.e.: measurement, sensing,
or transmission of data or power).
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Embedment
The process of completely encapsulating a component or module in a
resin.
Encapsulation
The encasement of a component in a coating by dipping, spraying, or
embedding with or without a mold, to provide mechanical support and
environmental protection.
Engineering Documentation:
Drawings and specifications which provide instructions, design
features, requirements, acceptance criteria, and other documentation
to invoke and/or modify requirements.
Hot Solder Dip (HSD)
A documented and controlled process that replaces the Pure tin (Sn)
plating finish with a Tin-Lead (SnPb) alloy finish by dipping the
component’s terminations in molten solder up to the component body
lead seal.
Lead Free Control Board
(LFCB)
The LFCB is the controlling authority for establishing the configuration
baseline for all Lead-Free Control Plans (LFCPs).
Lead-Free Control Plan (LFCP)
A documented process that assures that Aerospace and High
Performance (AHP), high-reliability electronics systems containing Pb-
free solder and Pure tin (Sn) plated piece part and board finishes will
continue to be reliable, safe, producible, affordable, and supportable.
Lead-Free Tin (Sn)
Metallic Tin (Sn) containing less than 3 percent lead (<3% Pb) by
weight as an alloying constituent.
Lead-Free Tin (Sn) Technology
Electrical / electronic components and associated mechanical
hardware and materials composed of, or coated / plated (internal /
external surfaces) with metallic Tin (Sn) containing less than 3 percent
lead (<3% Pb) by weight as an alloying constituent.
Mission Essential Support
Equipment
Equipment used in a closed loop within the flight and flight support
system, where the failure of this equipment would degrade the mission
or imperil personnel. This category includes items of ground support
equipment whose functions are necessary to support the pre-
countdown and countdown phases, whose failure can create a safety
hazard, cause damage to flight hardware, or create an inability to
detect a problem in the flight hardware.
Pure Tin
Tin (Sn) in any form (i.e.: metal, metallization, plating, solder, etc.),
whose composition is equal to or greater than 99.9 percent tin by
weight.
Solder
A nonferrous, fusible metallic alloy used to join metallic surfaces at
temperatures below +427°C (+800°F).
Solderability
The property of a surface that allows it to be wetted by molten solder.
Supplier
NASA, NASA contractors, and sub-tier contractors.
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Tin Pest (Tin Disease)
The autocatalytic, allotropic transformation of the element Tin (Sn) from
an electrically conductive, silver/white-colored metallic Tin (a.k.a.: beta-
tin/β-tin), to a semi-conductive, gray-colored, crumbly powder (a.k.a.:
alpha-tin/α-tin), when exposed to temperatures below +13°C (+56°F).
Tin Whisker
Tin whiskers are electrically conductive, mono-crystalline structures
that sometimes grow from surfaces where tin (especially bright
electroplated tin) is used as a plating finish. Tin whiskers have been
observed to grow at rates of several millimeters (mm) per year and in
rare instances to lengths in excess of 10 mm. They may be cylindrical,
kinked, or twisted, with smooth, flaky, or striated surfaces. Typically
they have an aspect ratio (length/width) greater than two (2), with
shorter growths referred to as nodules or odd-
shaped eruptions
(OSEs).
As crystalline structures, they are very strong, capable of surviving
launch and re-entry stresses, and capable of conducting significant
amounts of power before melting or vaporizing.
Tinning (Solder)
The process of selectively coating and metallurgically bonding a
solderable surface with a solder alloy.
X-Ray Fluorescence (XRF)
A form of elemental analysis where the properties of a material excited
by high-energy X-rays or gamma rays are determined by the emission
of characteristic "secondary" (or fluorescent) X-rays.
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Appendix A Project LFCP Template
LEAD-FREE CONTROL PLAN (LFCP)
Program: _________________
Project: __________________________________________________
Project Manager: _____________________________________________
IVA/EVA/Payload: _______________ Criticality: ____________
LFCP Control Level (Reference GEIA-STD-0005-2):
3 2C 2B 2A 1 0
(Please provide technical rationale if chosen Control Level is 2B or below)
Rationale: ___________________________________________________
Mitigation Measures Employed: Design
Hot Solder Dip (HSD)
Pretinning (Partial HSD)
Conformal Coating
Spray or Brush Application
Material: _________________
Dip Coating
Material: _________________
Chemical Vapor Deposition
Material: _________________
Embedment / Encapsulation
Surveillance (Inspection & Functional Test)
Other (Please Specify)
________________________________
Additional Note:
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